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ENIG / OSP pcb prototype assembly FR4 / tin plated pcb

Categories PCB Assembly
Place of Origin: Shenzhen, China
Brand Name: ZhenXian
Model Number: PCBA
Base Material: FR4
Surface Finishing: Tin plated
Packaging Details: Vacuum sealed package
Delivery Detail: 4 weeks
Min. Line Spacing: 0.15mm
Min. Line Width: 0.15mm
Min. Hole Size: 0.15mm
Board Thickness: 1.6mm
Copper Thickness: 1.0OZ
MOQ: NO MOQ
Price: Negotiated
Delivery Time: 5-12Days
Payment Terms: T/T,OA, L/C, Western Union
Supply Ability: 50000 Square Meter/Square Meters per Month
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    ENIG / OSP pcb prototype assembly FR4 / tin plated pcb

    ENIG / OSP pcb prototype assembly FR4 / tin plated pcb

    Specifications

    PCB assembly with reliable quality, 100% testing, fast delivery

    - Prototype PCB assembly manufacturing, quick turn samples delivery.
    - Full turnkey service: circuit design, PCB layout, PCB fabrication(manufacture), components procurement, PCB assembly, prototype, in-circuit testing, casing assembly, mould tooling, box-build assembly, packing manufacturing.
    - Our PCBA manufacturing experience in designing and manufacturing various modes of simulated and digital circuit, including middle or small dimension of LCD display technology, IR, supersonic, audio and screen signal processing, LED power supply, motor drive control for various industrial products.
    - PCB&PCBA&PCB assembly&EMS

    PCB Layers1Layers to 12 layer (Max)
    PCB MaterialFR4
    PCB Copper thickness35um
    Surface finish of PCBHASL, ENIG,OSP
    PCB Min holes0.2mm
    PCB Min wire width0.2mm
    PCB Min clearance0.2mm
    PCB Dimension scope457x567cm(max);4x3cm(min)
    IC Pitch(min)0.2mm
    Chip Size(min)0402/1005(1.0x0.5mm)
    BGA Size8x6mm~55x55mm
    BGA Pin Count48pins~600pins
    PackageSOP/SSOP/PLCC/QFP/QFN/BGA/FBGA/u-BGA
    u-BGA ball dia.0.2mm

    Cheap ENIG / OSP pcb prototype assembly FR4 / tin plated pcb for sale
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