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Rigid-flex PCBs Built on FR-4 and Polyimide with Green Solder Mask and Immersion Gold for Telemetry System

Categories Hybrid PCB Board
Brand Name: Bicheng Enterprise Limited
Model Number: BIC-275-V4.00
Certification: UL
Place of Origin: China
MOQ: 1
Price: USD50~60
Payment Terms: T/T, Paypal
Supply Ability: 45000 pieces per month
Delivery Time: 5-6 working days
Packaging Details: Vacuum
Board Material: 1.0mm FR-4 / 0.15mm Polyimide
Board Thickness: 1.0mm
Surface Cu thickness: 35 µm
Inner Iayer Cu thicknes: 35 µm
Surface Finish: Immersion Gold
Coverlay Colour: Yellow coverlay / Green solder mask
Color of Silkscreen: White
Function: 100% Pass electrical test
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    Rigid-flex PCBs Built on FR-4 and Polyimide with Green Solder Mask and Immersion Gold for Telemetry System

    Rigid-flex PCBs Built on FR-4 and Polyimide with Green Solder Mask and Immersion Gold for Telemetry System

    (FPC’s are custom-made products, the picture and parameters shown are just for reference)


    General description

    This is a type of rigid-flex PCB for the application of Telemetry System. It’s a 3 layer of rigid flex PCB. The base laminate is from ITEQ, It’s fabricated per IPC 6012 Class 2 using supplied Gerber data.


    Parameter and data sheet

    Size of Flexible PCB20.23 X 80.91mm
    Number of Layers3
    Board TypeRigid flex PCB
    Board Thickness1.0mm
    Board Material1.0mm FR-4 / 0.15mm Polyimide
    Board Material SupplierITEQ
    Tg Value of Board Material60℃
    PTH Cu thickness≥20 µm
    Inner Iayer Cu thicknes35 µm
    Surface Cu thickness35 µm
    Coverlay ColourYellow coverlay / Green solder mask
    Number of Coverlay2
    Thickness of Coverlay25 µm
    Stiffener Materialno
    Stiffener ThicknessN/A
    Type of Silkscreen InkIJR-4000 MW300
    Supplier of SilkscreenTAIYO
    Color of SilkscreenWhite
    Number of Silkscreen2
    Peeling test of CoverlayNo peelable
    Legend Adhesion3M 90℃ No peeling after Min. 3 times test
    Surface FinishImmersion Gold
    Thickness of Nickle/GoldAu: 0.03µm(Min.); Ni 2-4µm
    RoHS RequiredYes
    Famability94-V0
    Thermal Shock TestPass, -25℃±125℃, 1000 cycles.
    Thermal StressPass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering.
    Function100% Pass electrical test
    WorkmanshipCompliance with IPC-A-600H & IPC-6013C Class 2


    Features and benefits

    Excellent flexibility

    Reducing the volume

    Weight reduction

    Consistency of assembly

    Increased reliability

    The end can be whole soldered

    Low cost

    Continuity of processing

    Small quantity order is accepted

    DDU Door to door shipment with competitive shipping cost.


    Applications

    LCD module, mobile phone module flex board, Consumer electrostatic Bracelet soft board


    Structure of FPC

    According to the number of layers of conductive copper foil, FPC can be divided into single layer circuit, double layer circuit, multi-layer circuit, double sided and so on.


    Single-layer structure: the flexible circuit of this structure is the simplest structure of the flexible PCB. Usually the base material (dielectric substrates) + transparent rubber(adhesive) + copper foil is a set of purchased raw materials(semi-manufactures), the protective film and transparent glue are another kind of bought raw material. First, copper foil must be etched to obtain the required circuit, and the protective film should be drilled to reveal the corresponding pad. After cleaning, the two are combined by rolling. Then the exposed part of the pad electroplated gold or tin to protect. In this way, the big panel board will be ready. Generally also it’s stamped into the corresponding shape of the small circuit board. There is also no protective film directly on the copper foil, but printed resistance soldering coating, so that the cost will be lower, but the mechanical strength of the circuit board will become worse. Unless the strength requirement is not high and the price needs to be as low as possible, it is best to apply the protective film method.


    Double layer structure: when the circuit is too complex to be wired, or copper foil is needed to shield the ground, it is necessary to choose a double layer or even a multilayer. The most typical difference between a multilayer and a single plate is the addition of a perforated structure to connect the layers of copper foil. The first process of transparent rubber + base material + copper foil is to make holes. Drill holes in the base material and copper foil first, clean and then plated with a certain thickness of copper. The subsequent fabrication process is almost the same as the single-layer circuit.


    Double sided structure: both sides of the double sided FPC have pads, mainly used to connect other circuit boards. Although it and monolayer structure is similar, but the manufacturing process is very different. Its raw material is copper foil, protective film and transparent glue. The protective film should be drilled according to the position of the pad first, then the copper foil should be affixed, the pad and track lines should be etched and then the protective film of another drilled hole should be affixed.


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