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Rogers RO3003 6-layer RF PCB bonded by FastRise-28 Prepreg for High Speed Signal Transmission

Categories Arlon PCB Board
Brand Name: Bicheng Enterprise Limited
Model Number: BIC-106-V1.0
Certification: UL
Place of Origin: China
MOQ: 1
Price: USD 9.99-99.99 Per Piece
Payment Terms: T/T, Paypal
Supply Ability: 45000 pieces per month
Delivery Time: 12 working days
Packaging Details: Vacuum
Glass Epoxy: RO3003
Final height of PCB: 1.2 mm ±0.1mm
Final foil external:: 1oz
Surface Finish: Immersion gold (14.6% ) 0.05µm over 3µm nickel
Solder Mask Color:: Green
Colour of Component Legend: White
TEST: 100% Electrical Test prior shipment
Number of Layers: 6
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    Rogers RO3003 6-layer RF PCB bonded by FastRise-28 Prepreg for High Speed Signal Transmission

    Rogers RO3003 RF PCB bonding with FastRise-28 Prepreg for High Speed Signal Transmission

    (PCB's are custom-made products, the picture and parameters shown are just for reference)


    Rogers RO3003 high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. It was designed to offer exceptional electrical and mechanical stability at competitive prices. The mechanical properties are consistent. This allows the designer to develop multi-layer board designs without encountering warpages or reliability problems. RO3003 materials exhibit a coefficient of thermal expansion(CTE) in the X and Y axis of 17 ppm/℃. This expansion coefficient is matched to that of copper, which allows the material to exhibit excellent dimensional stability, with typical etch shrinkage, after etch and bake, of less than 0.5 mils per inch. The Z-axis CTE is 24 ppm/℃, which provides exceptional plated through-hole reliability, even in severe environments.


    Typical applications:

    1) Automotive radar

    2) Cellular telecommunications systems

    3) Datalink on cable systems

    4) Direct broadcast satellites

    5) Global positioning satellite antennas

    6) Patch antenna for wireless communications

    7) Power amplifiers and antennas

    8) Power backplanes

    9) Remote meter readers



    Data Sheet of RO3003

    RO3003 Typical Value
    PropertyRO3003DirectionUnitsConditionTest Method
    Dielectric Constant,εProcess3.0±0.04Z10 GHz/23℃IPC-TM-650 2.5.5.5 Clamped Stripline
    Dielectric Constant,εDesign3Z8GHz to 40 GHzDifferential Phase Length Method
    Dissipation Factor,tanδ0.001Z10 GHz/23℃IPC-TM-650 2.5.5.5
    Thermal Coefficient of ε-3Zppm/℃10 GHz -50℃to 150℃IPC-TM-650 2.5.5.5
    Dimensional Stability0.06
    0.07
    X
    Y
    mm/mCOND AIPC-TM-650 2.2.4
    Volume Resistivity107MΩ.cmCOND AIPC 2.5.17.1
    Surface Resistivity107COND AIPC 2.5.17.1
    Tensile Modulus930
    823
    X
    Y
    MPa23℃ASTM D 638
    Moisture Absorption0.04%D48/50IPC-TM-650 2.6.2.1
    Specific Heat0.9j/g/kCalculated
    Thermal Conductivity0.5W/M/K50℃ASTM D 5470
    Coefficient of Thermal Expansion
    (-55 to 288℃)
    17
    16
    25
    X
    Y
    Z
    ppm/℃23℃/50% RHIPC-TM-650 2.4.4.1
    Td500℃ TGAASTM D 3850
    Density2.1gm/cm323℃ASTM D 792
    Copper Peel Stength12.7Ib/in.1oz,EDC After Solder FloatIPC-TM 2.4.8
    FlammabilityV-0UL 94
    Lead-free Process CompatibleYes


    Taconic company's FastRise-28 semi-solidified sheet is specially designed for high-speed digital signal transmission applications and millimeter-wave RF multi-layer printed board manufacturing. It is matched with other microwave substrate materials of TACONIC company to manufacture multilayer microwave printed circuit boards.


    FastRise-28 semi-solidified sheet can meet the design requirements of stripline structure with low dielectric loss. The thermosetting properties of the adhesive material make it meet the design requirements of multiple laminated manufacturing. In addition, a large number of ceramic powder fillers are selected in the composition of the semi-solidified sheet, which makes the dimensional stability of the corresponding products very good. Because of its high performance thermosetting resin, it shows good bonding effect on copper foil and some PTFE materials.


    The main properties of this adhesive sheet material are shown in the table below.


    FastRise-28 (FR-28) Typical Value
    PropertyValueDirectionUnitsConditionTest Method
    Dielectric Constant,ε2.78--10 GHzIPC-TM-650 2.5.5.5.1
    Dissipation Factor,tanδ0.0015--10 GHzIPC-TM-650 2.5.5.5.1
    Water Absorption0.08%IPC TM-650 2.6.2.1
    Dielectric breakdown voltage49KVIPC TM-650 2.5.6
    Dielectric strength1090V/milASTM D 149
    Volume Resistivity8.00 x 108MΩ/cmIPC-TM-650 2.5.17.1
    Surface Resistivity3.48 x 108IPC-TM-650 2.5.17.1
    Tg188ASTM E 1640
    Tensil strength1690XpsiASTM D 882
    1480Ypsi
    Tensil modulus304XpsiASTM D 882
    295Ypsi
    Density1.82gm/cm³ASTM D-792 Method A
    Td709°FIPC TM-650 2.4.24.6
    Peel Strength7lbs/inIPC-TM-650 2.4.8
    Thermal Conductivity0.25W/mkASTM F433
    Coefficient of Thermal Expansion59
    70
    72
    X
    Y
    Z
    ppm/IPC-TM-650 2.4.41
    Hardness68Shore DASTM D 2240

    More FastRise Prepregs

    fastRise Prepreg
    ProductCarrier film (mil)Film Elognation (%)Pressed Thickness (mil)Pressed Thickness (mil)Pressed Thickness (mil)Nominal DK (Min. / Max.) (10 GHz)Typical Flow (%)
    FR-26-0025-601200-3002.71.312.5817
    FR-27-0030-252.330-603.52.1Not recommended2.74 (2.71 / 2.78)4
    FR-27-0035-661200-3003.72.52.12.736
    FR-27-0040-25330-604.93.7Not recommended2.744
    FR-28-0040-501200-3004.93.73.52.81 (2.80 / 2.82)23
    FR-27-0042-752.330-605.163.963.52.7335
    FR-27-0045-35330-605.84.64.22.75 (2.73 / 2.77)13
    FR-27-0050-40330-606.15.54.92.76 (2.71 / 2.80)23
    0.5 oz Cu. 50% removal1 oz. Cu. 50% removal

    Refrigeration

    FastRise is a non-reinforced prepreg that is manufactured between release liners so that individual plies of FastRise do not stick together. The adhesive layer on the surface of the PTFE/cereamic film can be quite tacky especially for freshly manufactured material. It is recommended to refrigerate FastRise prior to lamination. Continuous refrigeration is always a good practice for storing prepregs as this will extend the shelf lile. However, because FastRise can be quite tacky, FastRise should be refrigerated as close to 4℃ as possible. FastRise will stiffen up and will separate from the release liners a lot easier.


    Lamination

    Various laminate cores are used in conjunction with FastRise prepreg to produce multilayer boards for the RF/digital/ATE multilayer markets. FastRise when used in a symmetrical board design, will result in optimum electrical and mechanical performance. Because of the thermoset properties of the bonding agent, multiple bonding cycles can be achieved without worry of delamination. In addition, the recommended press temperature of 215.5℃ is within reach of most boards houses.


    Here’s a type of RF PCB built on Rogers RO3003 core bonding by FastRise-28. It is 6-layer stack-up with 1oz copper on each layer. Finished board will be 1.2mm thick, pads are immersion gold plated. There’s 2+N+2 steps blind via from layer 1 to layer 4. See the stack-up as follows.



    Cheap Rogers RO3003 6-layer RF PCB bonded by FastRise-28 Prepreg for High Speed Signal Transmission for sale
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