Hot Air Head And Mounting Head Integration Design BGA Rework Station

Hot Air Head And Mounting Head Integration Design BGA Rework Station

​Specification

Features

1.Hot air head and mounting head integration design, with auto soldering and desoldering functions.
2.Upper heaters adopt hot air system, heating faster, temperature evenness, cooling faster. (the temperature can be up to 50 to 80 centigrade).
3.Independent 3 heaters. upper and lower heaters can realize move synchronously and automatically, can reach IR every position. Lower heater zone can remove up and down, support PCB board.
4.PCB board adopts high accuracy slider to make sure the mount precision of BGA and PCB.
5.Unique bottom preheating table made of Germany-imported good quality heating materials plated.
6.Preheating table, clamping device and cooling system can move integrally in X axis that make PCB locating & desoldering safer and conveniently.
7.X and Y axis adopt motor automatic control moving way to make the alignment faster and more convenient.
8. Double rocker control the camera and upper and lower heating platform to make sure the alignment precision accuracy.
9.Inbuilt vacuum pump, rotate 360 in angel; fine-adjusting mounting suction nozzle.
10.Suction nozzle can detect BGA pickup and mounting height automatically with pressure controllable within 10 grams; zero pressure available to smaller BGA pickup and mounting.
11.Color high-resolution optical vision system, movable by hand in X/Y axis, with split vision, zoom in and fine-adjusting functions, aberration distinguish device included, auto-focus, software operation, 22x optical zoom; reworkable max. BGA size 80*80MM;
12.With 10 segments of temperature up (down) and 10 segments of constant temperature control, can save many segments of temperature.
13.Many sizes of alloy nozzle, easy for replacement; can locate at all angle.
14.With 5 thermocouple ports, can real-time detect and analyze temperatures at multipoint.
15.With a solid operation display function to make the temperature control more reliable.

Application

Suitable for mobile phones, hard drives, keyboards, electronic toys, computers, DVD, dots, plastics, electrical appliances, communication equipment, electrical appliances, toys, electronic processing, motors, motors, parts, tablets, notebook computers, digital cameras, remote controls, walkie-talkie, etc.

About Packaging

Shenzhen HanSome Technology Co.,Ltd(HSTECH)was estabilished in 2012 by prefessional and experienced engineer who wroked many years in EMS company,we specilized in PCB handling equipments at first, then we develop the PCB depaneling machine and SMT cleaning machine. HSTECH not only have professional technical team for R&D,but also have a outgoing and experienced marketing team for research and develop, grasps products developing directions, updates the products and technics to meet the continue changing demands. In the past years,we have been always keep innovating and exploing to make cost-efficient products to help our customers saving cost and labor, improving the production efficiency at the same time.
HSTECH set the goal for "High quality and Smart”, that based on the concept of "Quality-Oriented and Customer-orented", and combined the industry feature, smart technology persuit for the smart factory.As for the after-sale service, we insist on "responsibility", we will take reaction at the first when we got quality feedbacks,and service our customers all the time.