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8 Third Order HDI Circuit Boards , PCB Design Services Black Core Minimum Hole 0.10mm

Categories PCB Assembly Services
Brand Name: China chao sheng
Model Number: 8 third-order HDI+ reinforcement
Place of Origin: Shenzhen, Guangdong, China
MOQ: 1PCS
Price: Negotiation
Payment Terms: T/T, Western Union
Supply Ability: 5-200K/pcs per month
Delivery Time: 20-50K/pcs/day
Packaging Details: Anti-static bag + Anti-static bubble wrap + Good quality carton box
Certification: ISO/UL/RoHS/TS
Copper thickness: 1/2OZ 1OZ 2OZ 3OZ
Base material: FR-4
Min. line spacing: 3 Mil (0.075 Mm)
Board thickness: 1.6mm-3.2mm
Min. line width: 0.075mm/0.075mm(3mil/3mil)
Min. hole size: 4mil-laser drill
Surface finishing: ENIG
Product name: PCB Design
Service: One-stop Service
Solder mask color: White Black Yellow Green Red
Application: Medium and Small Projects
Type: PCB Design 94v-0 Circuit Board
Solder mask: Green. Red. Blue. White. Black.Yellow
Pcb standard: IPC-A-610 CLASS 2
Material: FR4 CEM1 CEM3 Hight TG
Layer: 10 Layer
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8 Third Order HDI Circuit Boards , PCB Design Services Black Core Minimum Hole 0.10mm

8 third-order HDI+ reinforcement,Shengyi FR-4+TG150+ black core material reinforcement, minimum hole 0.10mm,pcb printing

Product Description

  1. 8 third-order HDI+ reinforcement,Shengyi FR-4+TG150+ black core material reinforcement, minimum hole 0.10mm,pcb printing
  2. Product area: LED
  3. Number of layers: 6 second-order HDI plate thickness 1.60mm ± 10%;
  4. Process structure: Shengyi FR-4+TG150+ black core material reinforcement, minimum hole 0.10mm, copper thickness 1OZ, line width line spacing 4/4mil, impedance ±10%Ω, small spacing 0.12-0.13mm, 1.6 million holes, 2800 test Point, BGA reinforcement hole edge to IC line distance 0.05mm, with 500 times amplifier test, no glue is allowed
  5. Surface treatment: electric gold 1u"
  6. Quantities range from prototype to volume production.
  7. 100% E-Test
  8. Packing: true hole packaging + humidity card + moisture-proof beads / carton
  9. Printed circuit board (pcb) and PCBA product areas
    Communication terminals, communication stations, electronic communications, computers, household appliances, appliances, SD cards, SG cards, mobile phones, antennas, computers, automobiles, music equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, Aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products, computers and other product applications;
    Winding circuit board (fpc) and FPCA product areas
    CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital, camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument , Medical equipment, banking equipment, industrial instruments, LED strips, military industry, aviation, aerospace, national defense and other high-tech products, more than 70% of the products are exported to the Americas, Europe, Japan, Asia Pacific and other countries and regions.

Primary competitive advantages


Profound knowledge of contract manufacturing services

Capable of developing effective production process to ensure high-quality and consistency

Experienced logistics management

Cost-effective factory located in mainland China

Able to handle small as well as large volume production with flexibility
We also had launched six Sigma DMAIC program since January 2002
Our building products experience range: industrial, automotive, computing, storage, consumer, instrumentation, medicals, networking, peripherals and tele communications


Application


The PCBs are used for wide range of electronic products:

Such as Medical devices, Military equipment ,autos mobile ,CCTV, Power supply, GPS, UPS, Set-top Box, Telecommunication ,LED, etc.


PCB, FPC process production capability

Technical ltemMassProductAdvanced Technology
201620172018
Max.Layer Count26L36L80L
Through-hole plate2~45L2~60L2~80L
Max.PCBSize(in)24*52"25*62"25*78.75"
The layer number of FPC1~36L1~50L1~60L
Max.PCBSize(in)9.8"*196"9.8"*196"10"*196"Reel to reel
Layeredplatelayer2~12L2~18L2~26L
Max.PCBSize(in)9"*48"9"*52"9"*62"
Combination of hard and soft layers3~26L3~30L3~50L
Interconnect HDI5+X+5Interconnect HDI7+X+7Interconnect HDI8+X+8,Interconnect HDI
HDI PCB4~45L4~60L4~80L
Interconnect HDI3+20+34+X+4Interconnect HDI4+X+4,Interconnect HDI
Max.PCBSize(in)24"*43"24"*49"25"*52"
MaterialFR-4 RogersFR-4 RogersFR-4 Rogers
Base materialHalogenfree,LowDKHalogenfree,LowDKHalogenfree,LowDK
Build-up MaterialFR-4FR-4FR-4
BOard,Thickness(mm)Min.12L(mm)0.430.42~8.0mm0.38~10.0mm
Min.16L(mm)0.531.60~8.0mm0.45~10.0mm
Min.18L(mm)0.632.0~8.00.51~10.0mm
Min.52L(mm)0.82.50~8.0mm0.65~10.0mm
MAX(mm)3.510.0mm10.0mm
Min.CoreThickness um(mil)254"(10.0)254"(10.0)0.10~254(10.0mm)
Min.Build up Dielectric38(1.5)32(1.3)25(1.0)
BaseCopperWeightInner Layer4/1-8 OZ4/1-15 OZ4/1-0.30mm
Out Layer4/1-10 OZ4/1-15 OZ4/1-30 OZ
Gold thick1~40u"1~60u"1~120u"
Nithick76~127u"76~200u"1~250u"
Min.HOle/Land um(mil)150/300(6/12)100/200(4/8)100/200(4/8)
Min.Laser via/landum(mil)60/170(2.4/6.8)50/150(2/6)50/150(2/6)
Min. IVH,Hole size/landum(mil)150/300(6/12)100/200(4/8)100/200(4/8)
DieletricThickness38(1.5)32(1.3)32(1.3)
125(5)125(5)125(5)
SKipviaYesYesYes
viaoNhie(laserviaon BuriedPTH)YesYesYes
Laser Hole FillingYesYesYes
TechnicalltemMass ProductAdvanced Technolgy
2017year2018year2019year
Drill hole depth ratioThroughHole2017year.40:1.40:1
Aspet RatioMicro Via.35:11.2:11.2:1
Copper Filling Dimple Size um(Mil)10(0.4)10(0.4)10(0.4)
Min.LineWidth&spacelnner Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
Plated Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
BGAPitch mm(Mil)0.30.30.3
Min.PTH Hole ring um(mil)75(3mil)62.5(2.5mil)62.5(2.5mil)
Line Width Control∠2.5MIL±0.50±0.50±0.50
2.5Mil≤L/W∠4mil±0.50±0.50±0.50
≦3mil±0.60±0.60±0.60
Laminated structureLayer by layer3+N+34+N+45+N+5
Sequential Build-up20L Any Layer36L Any Layer52L Any Layer
Multi-layer overlayN+NN+NN+N
N+X+NN+X+NN+X+N
sequential Lamination2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
Soft and hard bonding2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
PTH filling processPTH resin plug hole + plating fill
Electroplated hole/copper plug hole
PTH resin plug hole + plating fill
Electroplated hole/copper plug hole
PTH resin plug hole + plating fill
Electroplated hole/copper plug hole

PCB, FPC main material supplier

NOsupplierSupply material nameMaterial origin
1JapanHigh frequency materials, PI, covering membrane,Copper berthMitsubishi Japan
2dupontHigh frequency materials, PI, covering film, dry film,Copper berthJapan
3panasonicHigh frequency materials, PI, covering membrane,Copper berthJapan
4SanTiePI, covering membraneJapan
5Born goodFR-4,PI,PP,Copper berthshenzhen, China
6A rainbowPI, covering membrane,Copper berthTaiwan
7teflonHigh frequency materialsThe United States
8RogersHigh frequency materialsThe United States
9Nippon SteelPI, covering membrane,Copper berthTaiwan
10sanyoPI, covering membrane,Copper berthJapan
11South AsiaFR-4,PI,PP,Copper berthTaiwan
12doosanFR-4,PPSouth Korea
13Tai Yao plateFR-4,PP,Copper berthTaiwan
14AlightFR-4,PP,Copper berthTaiwan
15YaoguangFR-4,PP,Copper berthTaiwan
16YalongFR-4,PPThe United States
17ISOALFR-4,PPJapan
18OAKBuried, buried resistance, PPJapan
19United States 3MFR-4,PPThe United States
20BergsCopper and aluminum matrixJapan
21The suninkTaiwan
22MuratainkJapan
23generous andbenevolentPI, covering membrane,Copper berthChina's jiangxi
24YasenPPI, covering membraneChina jiangsu
25Yong Sheng TaiinkChina guangdong panyu
26mitainkJapan
27Transcriptceramic materialTaiwan
28HOMEceramic materialJapan
29Fe-Ni-MnAlloy Invar, Section SteelTaiwan

PCB, FPC product application field

Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products


FAQ:

Q: What files do you use in PCB fabrication?

A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position

Q: Is it possible you could offer sample?

A: Yes, we can custom you sample to test before mass production

Q: When will I get the quotation after sent Gerber, BOM and test procedure?

A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.

Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?

A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing

Q: How can I make sure the quality of my PCB?

A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.

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